3D NAND

As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices. Based around the company's new replacement gate (RG) architecture, the memory manufacturer is gearing up to begin production in the current fiscal quarter (Q3'FY20), with commercial shipments set to begin in the fourth quarter. Overall, this will mark the start of a major technology transition for the manufacturer. As previously detailed by Micron, the company’s 4th Gen 3D NAND features up to 128 active layers and uses replacement gate (RG) technology, which replaces the traditional floating gate technology that has been used by Intel and Micron for years. The switch is a substantial design change, and...

28 TB of Storage in a Laptop? Eurocom Has It

Proving that where there's a will, there's a way, these days higher-end desktop replacement laptops can beat mainstream gaming desktops on general-purpose computing performance, graphics performance, and even RAM...

35 by Anton Shilov on 2/14/2020

SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020

Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...

7 by Anton Shilov on 2/3/2020

Western Digital Roadmap Updates: Energy Assisted Recording, Multi-Stage Actuators, Zoned Storage

Between CES at the beginning of the month, a series of presentations at Storage Field Day last week and a quarterly earnings report this week, we've heard from just...

115 by Billy Tallis on 1/31/2020

Western Digital and Kioxia Announce BiCS5 112-Layer 3D NAND

Western Digital and Kioxia have announced the successful development of their newest generation of 3D NAND flash memory. Their fifth-generation BiCS 3D NAND has commenced production in the form...

19 by Billy Tallis on 1/30/2020

CES 2020: Patriot Goes Big on Bandwidth For New EVLVR 2 TB3 SSDs

At this year's CES, Patriot has introduced an enhanced version of its EVLVR (Evolver) Thunderbolt 3 external SSD. The new drive is set to offer radically improved sequential read/write...

4 by Anton Shilov on 1/10/2020

CES 2020: Patriot Demonstrates PXD External SSD w/ USB-C

Among the many storage vendors at this year's CES was Patriot, who was showcasing its upcoming PXD external SSD. The device features a USB 3.1 Gen 2 Type-C interface...

5 by Anton Shilov on 1/9/2020

Fire At Kioxia & Western Digital NAND Fab - Impact on Supply to be Minimal

Kioxia has reportedly informed its customers that a production tool at one of its fabs caught fire early on Tuesday. The fire was promptly extinguished and no casualties were...

3 by Anton Shilov on 1/8/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

AnandTech Year In Review 2019: Solid State Drives

In 2019, flash memory prices have leveled out and have even crept back upward a bit, and new technologies have been slow to roll out, although we are currently...

42 by Billy Tallis on 12/31/2019

Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future

One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...

24 by Dr. Ian Cutress on 12/30/2019

Samsung to Expand 3D NAND Fab in China

Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...

5 by Anton Shilov on 12/17/2019

Macronix to Start Shipments of 3D NAND in 2020

Macronix, a Taiwan-based manufacturer for special-purpose memory solutions, will start volume shipments of its own 3D NAND memory in the second half of next year. The company will become...

2 by Anton Shilov on 12/11/2019

NAND Flash Revenue Peaks in Q3 Amid Production Cuts & Outages

Despite cuts in wafer starts by almost all NAND producers, and even disruptions in Kioxia (former Toshiba Memory) and Western Digital's fab operations, analysts estimate that bit shipments of...

10 by Anton Shilov on 12/4/2019

SK Hynix Sampling 128-layer 3D NAND SSDs

SK Hynix announced this week that they have started sampling products based on their 128-layer 3D NAND flash memory, which will soon start showing up in end-user devices. A...

9 by Billy Tallis & Anton Shilov on 11/21/2019

Kioxia Expands Automotive Grade eUFS Lineup: 512 GB for Extreme Conditions

Kioxia (formerly Toshiba Memory), has expanded its lineup of embedded UFS (eUFS) storage with a 512 GB device based on the company’s BiCS 3D NAND flash. The chip is...

2 by Anton Shilov on 11/15/2019

Western Digital Begins Shipments of 96-Layer 3D QLC-Based SSDs, Retail Products

Western Digital announced this week that it has started shipments of its first products based on 3D QLC NAND memory. The initial devices to use the highly-dense flash memory...

28 by Anton Shilov on 11/1/2019

Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon

Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...

10 by Anton Shilov on 10/4/2019

Goke Unveils Toshiba XL-Flash-Based NVMe SSDs: Ultra-Low Latency

Goke Microelectronics has introduced its new NVMe SSDs based on Toshiba’s XL-Flash NAND memory. The new drives are aimed at applications that require an ultra-low latency as well as...

8 by Anton Shilov on 10/2/2019

YMTC Starts Volume Production of 64-Layer 3D NAND

Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...

3 by Anton Shilov on 9/5/2019

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