TSMC

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won't be enough to keep up. To that end, several companies are developing silicon photonics solutions, including fab providers like TSMC, who this week outlined its 3D Optical Engine roadmap as part of its 2024 North American Technology Symposium, laying out its plan to bring up to 12.8 Tbps optical connectivity to TSMC-fabbed processors. TSMC's Compact Universal Photonic Engine (COUPE) stacks an electronics integrated circuit on photonic integrated circuit (EIC-on-PIC) using the company's SoIC-X packaging technology. The foundry says that usage...

GlobalFoundries and TSMC Sign Broad Cross-Licensing Agreement, Dismiss Lawsuits

GlobalFoundries and TSMC have announced this afternoon that they have signed a broad cross-licensing agreement, ending all of their ongoing legal disputes. Under the terms of the deal, the...

27 by Anton Shilov on 10/28/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019

Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...

18 by Anton Shilov on 10/18/2019

Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes

As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...

29 by Anton Shilov on 10/14/2019

TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon

TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...

27 by Anton Shilov on 10/8/2019

TSMC Counter-sues GlobalFoundries: Accuses US Fab of Infringing Patents Across Numerous Process Nodes

In a not-unexpected move, TSMC late on Monday filed a lawsuit against GlobalFoundries, its pure-play foundry rival, accusing the manufacturer of patent infringment. In the suit, a response to...

24 by Anton Shilov on 10/1/2019

Arm & TSMC Showcase 7nm Chiplet, Eight A72 at 4GHz on CoWoS Interposer

Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...

26 by Anton Shilov on 9/27/2019

TSMC Responds to Lawsuit by GlobalFoundries: Allegations Are Baseless

TSMC has responded to GlobalFoundries accusations of patents infringements. The world’s largest foundry said that it would defend itself in courts and that it considered allegations as baseless. The...

62 by Anton Shilov on 8/27/2019

GlobalFoundries Sues TSMC Over Patent Infringement; Apple, Qualcomm, Others Named Defendants

GlobalFoundries has filed a lawsuit against TSMC and its clients in the USA and Germany alleging the world’s largest contract maker of semiconductors of infringing 16 of its patents...

97 by Anton Shilov on 8/26/2019

Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)

The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...

12 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 Live Blogs: Intel Spring Crest NNP-T on 16nm TSMC

Intel is showing us some of the design features of its new ML training product, Spring Crest.

4 by Dr. Ian Cutress on 8/19/2019

TSMC Announces Performance-Enhanced 7nm & 5nm Process Technologies

TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. The company’s N7P and N5P technologies are designed for...

36 by Anton Shilov on 7/30/2019

TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged

Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is...

76 by Anton Shilov on 7/23/2019

TSMC: Most 7nm Clients Will Transition to 6nm

In this week's quarterly earnings conference call, TSMC’s revealed that the company expects most of its 7nm "N7" process customers to eventually transition to its forthcoming 6nm "N6" manufacturing...

39 by Anton Shilov on 5/1/2019

TSMC: No Plans to Buy Rivals at The Moment

Although TSMC expects demand for chips to increase going forward and despite an ongoing trend towards consolidation on the foundry market, the company has commented that it currently has...

4 by Anton Shilov on 4/22/2019

TSMC Reveals 6 nm Process Technology: 7 nm with Higher Transistor Density

TSMC this week unveiled its new 6 nm (CLN6FF, N6) manufacturing technology, which is set to deliver a considerably higher transistor density when compared to the company's 7 nm...

23 by Anton Shilov on 4/17/2019

TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready

TSMC this week has said that it has completed development of tools required for design of SoCs that are made using its 5 nm (CLN5FF, N5) fabrication technology. The...

33 by Anton Shilov on 4/5/2019

TSMC’s Fab 14B Photoresist Material Incident: $550 Million in Lost Revenue

TSMC on Friday revealed more details regarding an incident with a photoresist material at its Fab 14B earlier this year. The contaminated chemical damaged wafers on TSMC’s 12 nm...

29 by Anton Shilov on 2/20/2019

TSMC Chip Yields Hit By Bad Chemical Batch

TSMC on Monday said that some of the wafers it has processed recently have lower yields because of a chemical it uses during production. The company began investigation and...

28 by Anton Shilov on 1/29/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

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