Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier this year and takes advantage of the company’s 3DS (three-dimensional stacking) packaging. The new module will offer higher performance and lower power consumption than two 128 GB LRDIMMs used today. Samsung’s 256 GB DDR4 Registered DIMM with ECC carries 36 memory packages featuring 8 GB (64 Gbit) of capacity each, along with IDT’s 4RCD0229K register chip (to buffer address and command signals and increase the number of ranks supported by a memory channel). The packages are based on four single-die 16 Gb components that are interconnected using through-silicon vias (TSVs). Architecturally, the 256 GB module is...
Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...11 by Anton Shilov on 3/22/2018
For certain groups of users, Intel’s Xeon D product line has been a boon in performance per watt metrics. The goal of offering a fully integrated enterprise-class chip, with...23 by Ian Cutress on 2/7/2018
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...14 by Anton Shilov on 1/25/2018
Crucial has started shipments of its fastest and highest density server-class memory modules to date. Crucial’s 128 GB DDR4-2666 LRDIMMs are compatible with the latest memory-dense servers. These modules...28 by Anton Shilov on 12/2/2017
ASUS has quietly announced a new motherboard: the WS C621E SAGE (or just 'Sage' for short). This workstation class board offers users dual Intel LGA-3647 sockets with CPUs up...48 by Joe Shields on 10/24/2017