GPUs

Just shy of a year ago, SK Hynix threw their hat into the ring, as it were, by becoming the second company to announce memory based on the HBM2E standard. Now the company has announced that their improved high-speed, high density memory has gone into mass production, offering transfer rates up to 3.6 Gbps/pin, and capacities of up to 16GB per stack. As a quick refresher, HBM2E is a small update to the HBM2 standard to improve its performance, serving as a mid-generational kicker of sorts to allow for higher clockspeeds, higher densities (up to 24GB with 12 layers), and the underlying changes that are required to make those happen. Samsung was the first memory vendor to ship HBM2E with their 16GB/stack Flashbolt memory, which...

Quick Notes: Navi Refresh and RDNA2 Both In 2020, According to AMD

As part of today’s FY2019 earnings call, AMD CEO Dr. Lisa Su had a few words to say about AMD’s future GPU plans – an unexpected nugget of information...

89 by Ryan Smith on 1/28/2020

AMD's 4Q/FY19 Financial Report: Revenue up 50% from 4Q18, Debt Halved

AMD just announced its Q4 2019 and Financial Year 2019 Earnings Report. Here are the key points, along with AMD's presentation.

122 by Dr. Ian Cutress on 1/28/2020

AMD New Hires: Dan McNamara from Intel, Joshua Friedrich and Brad McCredie from IBM

There is always a fairly fluid movement of engineers in the companies we cover, but recently AMD has made a number of substantial hires into several of its biggest departments.

43 by Dr. Ian Cutress on 1/21/2020

The AMD Radeon RX 5600 XT Review, Feat. Sapphire Pulse: A New Challenger For Mainstream Gaming

While at this point we’ve pretty much reached the “mid-generation” point in the GPU space, that doesn’t mean activity in the GPU market is slowing down. Indeed, just three...

202 by Ryan Smith on 1/21/2020

NVIDIA Cuts Price of GeForce RTX 2060 To $299

With AMD set to launch their new 1080p-focused Radeon RX 5600 XT next Tuesday, NVIDIA isn’t wasting any time in shifting their own position to prepare for AMD’s latest...

59 by Ryan Smith on 1/16/2020

Vulkan 1.2 Specification Released: Refining For Efficiency & Development Simplicity

While the initial fervor over low-level graphics APIs has died down quite a bit since they first hit the scene in the middle of the last decade, API development...

23 by Ryan Smith on 1/15/2020

Seeing Is Believing: Intel Teases DG1 Discrete Xe GPU With Laptop & Desktop Dev Cards At CES 2020

While CES 2020 technically doesn’t wrap up for another couple of days, I’ve already been asked a good dozen or so times what the neatest or most surprising product...

84 by Ryan Smith on 1/9/2020

AMD at CES 2020: Q&A with Dr. Lisa Su

This week AMD took the wraps off of its latest generation of mobile processors. The company is being aggressive, offering up to eight cores for both the traditional ultra-portable...

93 by Dr. Ian Cutress on 1/7/2020

AMD Announces Radeon RX 5600 Series: A Lighter Navi To Rule 1080p Gaming

With the launch of the Radeon RX 5700 series and Radeon RX 5500 XT under their collective belt, AMD is now getting ready to fill in the divide between...

83 by Ryan Smith on 1/6/2020

AMD Keynote Presentation Press Event at CES 2020: The AnandTech Live Blog

We're here ready to Live Blog the annual CES keynote from AMD. We expect to see Lisa Su, Frank Azor, and others take to the stage to discuss what's...

19 by Dr. Ian Cutress & Gavin Bonshor on 1/6/2020

NVIDIA Releases CES Game Ready Driver: Variable Rate SSAA for VR, Max Frame Rate Control, & More

While NVIDIA doesn’t have any new GPU hardware to show off at this year’s CES, the company is not coming entirely empty-handed. Along with a couple of monitor announcements...

6 by Ryan Smith on 1/6/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

Imagination and Apple Renew IP Licensing Agreement

Today Imagination Technologies has announced that Apple has signed a new multi-year licensing with the company, giving the Cupertino company continued access to Imagination’s IP.

27 by Andrei Frumusanu on 1/2/2020

An Interview with AMD’s CTO Mark Papermaster: ‘There’s More Room At The Top’

On the back of a very busy 2019, AMD is gaining market share and is now a performance leader in a lot of CPU segments. The company has executed...

68 by Dr. Ian Cutress on 12/30/2019

Analyzing Intel’s Discrete Xe-HPC Graphics Disclosure: Ponte Vecchio, Rambo Cache, and Gelato

It has been a couple of weeks since Intel formally provided some high-level detail on its new discrete graphics strategy. The reason for the announcements and disclosures centered around...

47 by Dr. Ian Cutress on 12/24/2019

In The Lab: ASRock Radeon RX 5700 XT Taichi X 8G OC+ Graphics Card

Since AMD unveiled its products on the 7 nm process node, we've seen numerous CPU launches and announcements with the Ryzen 3000 series of processors. Not only processors but...

14 by Gavin Bonshor on 12/23/2019

The NVIDIA GeForce GTX 1650 Super Review, Feat. Zotac Gaming: Bringing Balance To 1080p

Bringing 2019 to a close in the GPU space, we have one final video card review for the year: NVIDIA’s GeForce GTX 1650 Super. The last of the company’s...

67 by Ryan Smith on 12/20/2019

The AMD Radeon RX 5500 XT Review, Feat. Sapphire Pulse: Navi For 1080p

Launching today are AMD’s Radeon RX 5500 XT cards. These cards are aimed at the sub-$200 market for 1080p gaming, effectively (and finally) replacing AMD’s long-lived Radeon RX 580...

96 by Ryan Smith on 12/12/2019

Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...

138 by Dr. Ian Cutress on 12/11/2019

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

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