3DFabric
TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company's capacity for building high-end, multi-chiplet products. The facility is said to be the first all-in-one automated fab offering 3DFabric integration of front-end to back-end process and testing services. TSMC's Advanced Backend Fab 6 can process about one million 300-mm wafers per year as well as more than 10 million hours of testing per year. The factory occupies 14.3 hectares in Zhunan Science Park and has a cleanroom that is larger than the combined cleanroom spaces of all other TSMC advanced backend fabs, making it TSMC's biggest advanced packaging facility to date, according to the company. TSMC said that its Advanced Backend Fab 6 is ready for...
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40 by Anton Shilov on 6/27/2022
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18 by Dr. Ian Cutress on 6/8/2021
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93 by Dr. Ian Cutress on 5/31/2021
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9 by Dr. Ian Cutress on 9/2/2020
TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification
Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging...
19 by Andrei Frumusanu on 8/25/2020
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