Realtek Accuses MediaTek of Conspiring Against It with Patent Hoarder
This week, Realtek sued rival MediaTek in Northern California federal court, accusing it of conspiring against it with a patent holder in a bid to drive Realtek out of...
6 by on 6/7/2023
Intel Expands ProViz Offerings with Arc Pro A60, Arc Pro A60M Graphics Cards
Intel this week introduced its highest performing products aimed at professional visualization market: the Arc Pro A60 12 GB graphics card for desktops as well as the Arc Pro...
8 by on 6/7/2023
Western Digital Unveils Xbox Series X|S Expansion Cards
Ever since Microsoft introduced its Xbox Series X/S game consoles in late 2020, Seagate has been exclusively selling storage expansion cards for these systems. But to the chagrin of...
8 by on 6/6/2023
Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex
Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now...
4 by on 6/2/2023
Meta Reveals Quest 3 VR Headset: Higher Resolutions and Next-Gen Snapdragon SoC
Meta on Thursday announced the Quest 3, its next generation all-in-one untethered VR/MR headset. The updated headset is based around a newer Qualcomm SoC for VR/MR applications, offering increased...
6 by on 6/2/2023
Biostar Joins Intel Arc Camp, Preps Arc Video Cards
Without much fanfare, Biostar has introduced its first graphics card based on Intel Arc graphics processors. The add-in-board is aimed at entry-level gaming PCs, and is admittedly not very...
2 by on 6/1/2023
Streacom's SG10 Passive Cooling Case Can Handle Even a GeForce RTX 4080 without Fans
For Computex 2023, Streacom is demonstrating its SG10 passively-cooled PC chassis that can accommodate high-end PCs without requiring active cooling fans. The SG10 case is designed for fully-fledged gaming...
11 by on 6/1/2023
TeamGroup Goes Big on SSD Cooling, Demos 120mm AIO Liquid Cooler For M.2 Drives
TeamGroup is demonstrating at Computex 2023 what it claims to be the world's first all-in-one liquid cooling system for hot-running M.2 SSDs. The SSD-sized Siren cooler is meant to...
10 by on 6/1/2023
TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...
15 by on 5/31/2023
MSI Intros USB4 PCIe Expansion Card with 100W Power Delivery
For Computex 2023, MSI is introducing an interesting USB4 PCIe expansion card. The card not only offers two full-bandwidth USB4 40Gbps Type-C ports, but the card can also deliver...
19 by on 5/31/2023
Asus Details ROG Matrix GeForce RTX 4090: Liquid Cooling Meets Liquid Metal
Asus has introduced a new flagship RTX 4090 graphics card that uses an all-in-one liquid cooling system combined with liquid metal thermal interface. Dubbed the ROG Matrix GeForce RTX...
6 by on 5/30/2023
Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000
Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer...
5 by on 5/30/2023
SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...
5 by on 5/30/2023
Phison Unveils PS5031-E31T SSD Platform For Lower-Power Mainstream PCIe 5 SSDs
At Computex 2023, Phison is introducing a new, lower-cost SSD controller for building mainstream PCIe 5.0 SSDs. The Phison PS5031-E31T is a quad channel, DRAM-less controller for solid-state drives...
10 by on 5/29/2023
TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors
As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that...
2 by on 5/26/2023
TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage
At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable...
5 by on 5/26/2023
TSMC: We Have Working CFET Transistors in the Lab, But They Are Generations Away
Offering an update on its work with complementary field-effect transistors (CFETs) as part of the company's European Technology Symposium 2023, TSMC has revealed that it has working CFETs within...
3 by on 5/25/2023
Micron Expects Impact as China Bans Its Products from 'Critical' Industries
In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...
12 by on 5/23/2023
Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025
Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...
10 by on 5/19/2023
Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works
Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power...
18 by on 5/18/2023
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