EUV

TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting increasingly difficult to maintain such a cadence. The company has previously acknowledged that it will start producing chips using its N3 (3 nm) node about four months later than the industry is used to (i.e., Q2), and in a recent conference call with analysts, TSMC revealed additional details about its latest process technology roadmap, focusing on their N3, N3E, and N2 (2 nm) technologies. N3 in 2023 TSMC's N3 technology will provide full node scaling compared to N5, so its adopters will get all performance (10% - 15%), power (-25% ~ -30%), and area (1.7x higher for...

Samsung Foundry: 2nm Silicon in 2025

One of the key semiconductor technologies beyond 3D FinFET transistors are Gate-All-Around transistors, which show promise to help extend the ability to drive processors and components to higher performance...

27 by Dr. Ian Cutress on 10/6/2021

Samsung Foundry to Almost Double Output by 2026

It’s hard not to notice that we’re in the middle of a semiconductor crunch right now. Factories are running at full steam, but pinch points in the supply chain...

6 by Dr. Ian Cutress on 10/6/2021

An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers...

28 by Dr. Ian Cutress on 6/8/2021

SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab...

41 by Anton Shilov on 4/2/2021

EUV Pellicles Ready For Fabs, Expected to Boost Chip Yields and Sizes

Foundries started limited usage of extreme ultraviolet (EUV) lithography for high-volume manufacturing (HVM) of chips in 2019. At the time, ASML's Twinscan NXE scanners were good enough for production...

35 by Anton Shilov on 3/31/2021

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

32 by Dr. Ian Cutress on 8/27/2020

‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5

One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...

107 by Dr. Ian Cutress on 8/25/2020

TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production

At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...

58 by Andrei Frumusanu on 8/24/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified

As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with...

37 by Dr. Ian Cutress on 3/5/2020

TSMC & Broadcom Develop 1,700 mm2 CoWoS Interposer: 2X Larger Than Reticles

With transistor shrinks slowing and demand for HPC gear growing, as of late there has been an increased interest in chip solutions larger than the reticle size of a...

18 by Anton Shilov on 3/4/2020

Intel CFO: Our 10nm Will Be Less Profitable than 22nm [Morgan Stanley Transcription]

This week at Morgan Stanley’s Analyst Conference, Intel’s CFO, George Davis, sat down to discuss the future of where Intel’s profitability lies. No stranger to the odd comments relating...

92 by Dr. Ian Cutress on 3/4/2020

Samsung Starts Mass Production at V1: A Dedicated EUV Fab for 7nm, 6nm, 5nm, 4nm, 3nm Nodes

Samsung Foundry has started mass production of chips using its 6LPP and 7LPP manufacturing processes at its new V1 fab. The new facility employs one of the industry’s first...

29 by Anton Shilov on 2/20/2020

ASML Ramps Up EUV Scanners Production: 35 in 2020, Up to 50 in 2021

ASML shipped 26 extreme ultraviolet lithography (EUVL) step-and-scan systems to its customers last year, and the company plans to increase shipments to around 35 in 2020. And the ramp-up...

22 by Anton Shilov on 1/23/2020

TSMC Boosts CapEx by $1 Billion, Expects N5 Node to Be Major Success

TSMC is on track to begin high-volume production of chips using its 5 nm technology in the coming months, the company said in its conference call last week. While...

40 by Anton Shilov on 1/22/2020

Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton

Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...

21 by Anton Shilov on 12/11/2019

EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look

One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...

29 by Dr. Ian Cutress on 12/11/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

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