EUV

Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its ambitious plan to invest $40 billion in its U.S.-based manufacturing capacities by the end of this decade as well as spend $150 billion on new fabs by 2030 globally. Micron's upcoming leading-edge fab will produce DRAM and will be a rather colossal manufacturing facility. At build-out, when the fab is fully equipped with tools, its cleanroom space will reach 600,000 feet2 (55,700 meters2), which is about two times larger compared to cleanroom space at GlobalFoundries' Fab 8 and which is comparable to cleanroom space at giant fabs operated by Micron's rivals Samsung and SK Hynix is...

SK Hynix Starts Prepping for Next Semiconductor Boom with $11 Billion Memory Fab

When a major South Korean memory firm invests over $11 billion in a fab, that raises a couple of eyebrows. But when it comes within a major $100+ billion...

5 by Anton Shilov on 9/8/2022

Intel Kicks Off Fab Co-Investment Program with Brookfield: New Fabs to be Jointly Owned

Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the...

28 by Anton Shilov on 8/24/2022

TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard

TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...

13 by Anton Shilov on 7/21/2022

Intel 4 Process Node In Detail: 2x Density Scaling, 20% Improved Performance

Taking place this week is the IEEE’s annual VLSI Symposium, one of the industry’s major events for disclosing and discussing new chip manufacturing techniques. One of the most anticipated...

129 by Ryan Smith on 6/13/2022

Intel Discloses Multi-Generation Xeon Scalable Roadmap: New E-Core Only Xeons in 2024

It’s no secret that Intel’s enterprise processor platform has been stretched in recent generations. Compared to the competition, Intel is chasing its multi-die strategy while relying on a manufacturing...

147 by Dr. Ian Cutress on 2/17/2022

Texas To Get Multiple New Fabs as Samsung and TI to Spend $47 Billion on New Facilities

After a year of searching for the right place of its new U.S. fab, Samsung this week announced that it would build a fab near Taylor, Texas. The company...

135 by Anton Shilov on 11/24/2021

Bringing Geek Back: Q&A with Intel CEO Pat Gelsinger

One of the overriding key themes of Pat Gelsinger’s ten-month tenure at Intel has been the eponymous will to ‘bring geek back’ to the company, implying a return to...

49 by Dr. Ian Cutress on 10/29/2021

TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025

TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...

32 by Anton Shilov on 10/18/2021

Samsung Foundry: 2nm Silicon in 2025

One of the key semiconductor technologies beyond 3D FinFET transistors are Gate-All-Around transistors, which show promise to help extend the ability to drive processors and components to higher performance...

29 by Dr. Ian Cutress on 10/6/2021

Samsung Foundry to Almost Double Output by 2026

It’s hard not to notice that we’re in the middle of a semiconductor crunch right now. Factories are running at full steam, but pinch points in the supply chain...

6 by Dr. Ian Cutress on 10/6/2021

An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers...

18 by Dr. Ian Cutress on 6/8/2021

SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab...

41 by Anton Shilov on 4/2/2021

EUV Pellicles Ready For Fabs, Expected to Boost Chip Yields and Sizes

Foundries started limited usage of extreme ultraviolet (EUV) lithography for high-volume manufacturing (HVM) of chips in 2019. At the time, ASML's Twinscan NXE scanners were good enough for production...

35 by Anton Shilov on 3/31/2021

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

32 by Dr. Ian Cutress on 8/27/2020

‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5

One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...

107 by Dr. Ian Cutress on 8/25/2020

TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production

At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...

58 by Andrei Frumusanu on 8/24/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified

As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with...

37 by Dr. Ian Cutress on 3/5/2020

TSMC & Broadcom Develop 1,700 mm2 CoWoS Interposer: 2X Larger Than Reticles

With transistor shrinks slowing and demand for HPC gear growing, as of late there has been an increased interest in chip solutions larger than the reticle size of a...

18 by Anton Shilov on 3/4/2020

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